TY  - BOOK
AU  - Chen, Andrea.,
TI  - Semiconductor Packaging : Materials, Interaction and Reliability
SN  - 9781439862056
U1  - 621 
PY  - 2012///
CY  - Boca Raton
PB  - CRC Press
KW  - Applied physics
KW  - Packaging
KW  - Semiconductor Packaging
ER  -