| 000 | 00664nam a2200181Ia 45e0 | ||
|---|---|---|---|
| 008 | 131224n2012 xxu |||gr||||Z||||||eng | ||
| 020 | _a9781439862056 | ||
| 082 | _a621 | ||
| 100 |
_aChen, Andrea., _eAuthor., |
||
| 245 | 0 |
_aSemiconductor Packaging : Materials, Interaction and Reliability _cAndrea Chen _hTextual Documents |
|
| 260 |
_aBoca Raton _bCRC Press _c2012 |
||
| 300 | _a198. | ||
| 653 | _aApplied physics | ||
| 653 | _aPackaging | ||
| 653 | _aSemiconductor Packaging | ||
| 701 |
_aLo, Randy Hsiao-Yu, _eAuthor. |
||
| 942 |
_2ddc _cTXT |
||
| 999 |
_c33963 _d33963 |
||